Siloxane-containing solar cell metallization pastes

ABSTRACT

Frontside metallization pastes for solar cell electrodes contain siloxanes. Metallization pastes containing siloxanes can be used to fabricate fine line, high aspect ratio, solar cell gridlines.

This application is Continuation of International Application No.PCT/CN2016/111036 filed on Dec. 20, 2016, which is incorporated byreference in its entirety.

FIELD

Screen-printable metallization pastes for use in the fabrication ofsolar cell electrodes are disclosed. The solar cell metallization pastescontain siloxane.

BACKGROUND

Solar cells are manufactured in high volume using high throughputproduction methods. In high volume production solar cell metallizationpaste can be screen-printed at a rate of 3,500 wafers/hour. To reducecosts and improve solar cell performance it is desirable that thedimensions of front side electrodes be reduced. In high volumeproduction, front side electrodes are typically fabricated by screenprinting a metallization paste through a fine wire mesh. It ischallenging to achieve integral fine-line front-side grid metallizationhaving an aspect ratio greater than about 0.4 without discontinuitieswhen printing metallization pastes through screens having openings lessthan 38 μm. Currently, screen openings can be around 34 μm. Linediscontinuity can occur when the paste passes through the screenopenings in the wire mesh, and the percent open area is smaller than theemulsion pattern of the gridline. The intersecting wires that form theprinting mesh can also result in an interference or ‘necking’ pattern ofthe screen-printed gridlines that may show intervals of narrow widthsthat lead to increased gridline resistance. Also, if the paste is notwell designed, the width of the printed gridlines can be up to 50% widerthan the screen opening.

To provide an economical process for manufacturing solar cell gridlines,there is a need for thick-film metallization pastes that can bescreen-printed through fine mesh screens at high speeds such as greaterthan 200 mm/sec, greater than 300 mm/sec, or greater than 350 mm/sec toprovide conductive grids with small feature dimensions and high aspectratios, and that exhibit low resistivity, high adhesion strength to thesemiconductor substrate, and excellent solderability.

SUMMARY

According to the present invention, a metallization paste comprises from0.01 wt % to 3 wt % of a siloxane, wherein the siloxane comprises apolysiloxane, a polysiloxane-modified resin, or a combination thereof;and wt % is based on the total weight of the metallization paste.

According to the present invention, invention, a solar cell electrode isprepared by applying the metallization paste of claim 1 to a surface ofa solar cell; drying the applied metallization paste; and firing thedried metallization paste to provide a solar cell electrode.

According to the present invention, a method of fabricating a solar cellelectrode, comprises applying the metallization paste of claim 1 to asurface of a solar cell; drying the applied metallization paste; andfiring the dried metallization paste to provide a solar cell electrode.

BRIEF DESCRIPTION OF THE DRAWINGS

Those skilled in the art will understand that the drawings describedherein are for illustration purposes only. The drawings are not intendedto limit the scope of the present disclosure.

FIG. 1 is a graph showing the shear-thinning flow with shear rate formetallization pastes with and without a siloxane.

FIG. 2A shows an EL image of gridlines on a monocrystalline siliconsolar cell printed using a metallization paste without a siloxaneadditive.

FIG. 2B shows an electroluminescence (EL) of gridlines on amonocrystalline silicon solar cell printed using a metallization pastewith a siloxane additive. The dark regions in the EL images representdiscontinuities in the printed gridlines causing higher electricalresistance to current flow.

DETAILED DESCRIPTION

Solar cell metallization pastes comprising a siloxane can provide highperformance solar cell gridlines with small feature dimensions.

Siloxanes can reduce the surface tension and increase the hydrophobicityof a solar cell metallization paste and thereby facilitate the abilityof the metallization paste to flow through a fine wire mesh withoutforming discontinuities in the printed gridlines. Small featuregridlines reduce optical shading and increase the overall photocurrentgenerated by a solar cell. Siloxanes can also act as defoamers and canreduce the wet weight of the printed paste. The addition of siloxanes toa metallization paste does not adversely affect the electricalproperties of the fired gridlines compared to corresponding gridlinesfabricated using metallization pastes without a siloxane.

A solar cell metallization paste can comprise a siloxane, silver (Ag)particles, glass frit, and a an organic vehicle. An organic vehicle cancomprise an organic binder, solvent, and additives.

A metallization paste can also comprise a siloxane or a combination ofsiloxanes.

A siloxane can comprise a polysiloxane, a polysiloxane-modified resin,or a combination thereof. A siloxane refers to a polymer havingrepeating siloxane —O—Si—O— groups. A siloxane can have any suitableterminal groups such as a terminal alkoxysilyl group. hydroxyl group(—OH), alkenyl group (—CH═CH₂), or epoxy group.

An alkoxysilyl group can have the structure —Si(—R¹)_(m)(—R²)_(3-m),where R¹ is C₁₋₆ alkyl, R² is C₁₋₆ alkoxy, and m is an integer from 1 to3. R¹ can be, for example, methyl or ethyl, and R² can be methoxy orethoxy, and m can be 1, 2, or 3.

A polysiloxane can be a homopolymer, a copolymer, or a combinationthereof. A polysiloxane can have organic groups pendent to thepolysiloxane backbone, at both ends of the polysiloxane chain, at oneend of the polysiloxane chain, or pendent to the polysiloxane backboneand at one or both ends of the polysiloxane chain.

Examples of suitable polysiloxane homopolymers includehexamethylsiloxane, bis(3-aminopropyl) terminatedpoly(dimethylsiloxane), poly(dimethylsiloxane, diglycidylether-terminated (polydimethylsiloxane), hydride-terminated(polydimethylsiloxane), hydroxy-terminated (polydimethylsiloxane),monoacrylamidopropyl-terminated (polydimethylsiloxane), vinyl-terminated(polydimethylsiloxane), poly(methylhydrosiloxane),trimethylsilyl-terminated poly(methylhydrosiloxane),poly(methylphenylsiloxane), and combinations of any of the foregoing.

Examples of suitable polysiloxane copolymers includepoly(dimethylsiloxane-co-alkylmethylsiloxane),poly(dimethylsiloxane-co-(3-aminopropyl)methylsiloxane),dihydroxy-terminated poly(dimethylsiloxane-co-diphenylsiloxane),divinyl-terminated poly(dimethylsiloxane-co-diphenylsiloxane), poly[dimethylsiloxane-co-(2-(3,4-epoxycyclohexyl)ethyl)methylsiloxane], poly[dimethylsiloxane-co-[3-(2-(2-hydroxyethoxy)ethoxy)propyl]methylsicoxane],trimethylsilyl-terminated poly(dimethylsiloxane-co-methylhydrosiloxane),poly(dimethylsiloxane-co-methylphenylsiloxane),poly(dimethylsiloxane-co-methyl(stearoyloxyalkyl)siloxane],poly(dimethylsiloxane)-graft-polyacrylates, and combinations of any ofthe foregoing.

A polysiloxane can comprise poly(dimethylsiloxane),poly(methylhydrosiloxane) or a combination thereof. A polysiloxane cancomprise an alkylsilyl-terminated poly(dimethylsiloxane), analkoxysilyl-terminated poly(methylhydrosiloxane), or a combinationthereof. A polysiloxane can comprise a trimethylsilyl-terminatedpoly(dimethylsiloxane), an trimethyl-terminatedpoly(methylhydrosiloxane), or a combination thereof.

A siloxane can comprise a poly(methylhydrosiloxane) or a combination ofpoly(methylhydrosiloxane). A polysiloxane can comprise apoly(dimethylsiloxane), or a combination of poly(dimethylsiloxanes).

A polysiloxane such as a poly(methylhydrosiloxane) or apoly(dimethylsiloxane), can have an average molecular weight, forexample, from 500 Daltons to 5,000 Daltons, from 750 Daltons to 4,500Daltons, from 1,000 Daltons to 4,000 Daltons or from 1,500 Daltons to4,500 Daltons. A polysiloxane such as a poly(methylhydrosiloxane) or apoly(dimethylsiloxane), can have an average molecular weight, forexample, from 1,000 Daltons to 100,000 Daltons, from 1,000 Daltons to50,000 Daltons, or from 3,000 Daltons to 25,000 Daltons. Molecularweight can be determined using gel permeation chromatography usingpolystyrene standards.

A polysiloxane can be characterized by a viscosity, for example, from 5cSt to 100 cSt, from 5 cSt to 75 cSt, or from 10 cSt to 50 cSt.

A siloxane can comprise a polysiloxane-modified resin.

A resin used as an organic vehicle in a metallization paste can bemodified to improve printability and printed line definition. In thepolysiloxane-modified resin, one or more of the terminal and/or pendentgroups of the resin can be modified to provide a desired property. Amodifying group can be a reactive group intended to chemically reactwith one or more other components of the metallization paste or amodifying group can be change a physical property of the metallizationpaste.

Poly siloxane-modified resins include polysiloxane-modified blockcopolymers and polysiloxane-modified graft copolymers.

A polysiloxane-modified block copolymer comprises segments of apolysiloxane and segments of another polymeric resin in the copolymerbackbone. The two segments comprising a block copolymer can bealternating. In a polysiloxane-modified block copolymer having reactivefunctional groups a polysiloxane can reacted with a polymeric resinhaving functional groups that are reactive with the functional groups ofthe polysiloxane.

Examples of suitable polymeric resins include acrylics, urethanes,epoxies, polyimides, polyethers, and polycarbonates. Other suitablepolymers can be used such as polymeric resins typically used in solarcell grid line metallization pastes.

A polysiloxane-modified resin can comprise a graft copolymer in whichpolysiloxanes are grafted onto a polymeric resin backbone. Thepolysiloxanes form moieties that are pendent from the backbone of thepolymeric resin.

Any of the polysiloxanes disclosed herein having or modified to have asuitable reactive group can be reacted with appropriate reactive groupsof a polymeric resin to provide suitable polysiloxane-modified blockcopolymers are/or polysiloxane-modified graft copolymers.

Examples of suitable polysiloxane-modified resins includepolysiloxane-modified alkyd resins, polysiloxane-modified polyesterresins, a polysiloxane-modified epoxy resins, polysiloxane-modifiedacrylic resins, polysiloxane-modified cellulose resins, or a combinationof any of the foregoing. Such polysiloxane-modified resins can be blockcopolymers, graft copolymers, or a combination of block and graftcopolymers.

A solar cell metallization paste can comprise, for example, from 0.01 wt% to 5 wt %, from 0.01 wt % to 4 wt %, from 0.01 wt % to 3 wt %, from0.1 wt % to 2 wt %, or from 0.1 wt % to 1 wt % of a siloxane or acombination of siloxanes, where wt % is based on the total weight of themetallization paste.

A siloxane can have a molecular weight, for example, from 250 Daltons to30,000 Daltons, from 500 Daltons to 25,000 Daltons, from 500 Daltons to20,000 Daltons, from 1,000 Daltons to 15,000 Daltons or from 2,000Daltons to 5,000 Daltons.

A siloxane can be characterized by a surface tension, for example, from15 dyn/cm to 30 dyn/cm, from 17 dyn/cm to 28 dyn/cm, from 19 dyn/cm to26 dyn/cm, or from 21 dyn/cm to 24 dyn/cm. A polysiloxane such aspolydimethylsiloxane can be characterized by a surface tension, forexample, from 15 dyn/cm to 30 dyn/cm, from 17 dyn/cm to 28 dyn/cm, from19 dyn/cm to 26 dyn/cm, or from 21 dyn/cm to 24 dyn/cm.

Metallization pastes can comprise an organic resin or combination oforganic resins, which serve as binders.

An organic binder, also referred to as an organic resin, can be used toimpart a desired viscosity and/or rheological property to ametallization paste to facilitate screen printing solar cell electrodes.The organic resin can also facilitate homogeneous dispersion of theinorganic component of the metallization paste within the printablecomposition. Some or all of the organic binder can be replaced with asiloxane.

Suitable organic binders include, for example, acrylate resins andcellulose resins such as ethylcellulose, ethyl hydroxyethylcellulose,nitrocellulose, blends of ethylcellulose and phenol resins, alkydresins, phenol resins, acrylate esters, xylenes, polybutanes,polyesters, ureas, melamines, vinyl acetate resins, wood rosin,polymethacrylates of alcohols, and combinations of any of the foregoing.

Other suitable resins include, for example, acrylates,diallylphthalates, epoxides, poly imides, furans, melamines, parylenes,phenol-formaldehydes, methylmethacrylates, polyesters,urea-formaldehydes, urethanes, polyacetals, polyacrylates, polyamides,polyamide-imides, polybutylene terephthalates, polycarbonates, polyetherketones, polyethylenes, polyphenylene sulfides, polypropylenes,polystyrenes, polysulfones, polyvinyl butyrals, polyvinyl chlorides, andcombinations of any of the foregoing.

Other suitable resins include, for example, ethyl cellulose, celluloseester (CAB, CAP), polyacrylate, polysiloxane (modified), polyvinylbutyral (PVB), polyvinyl pyrrolidone (PVP), saturated polyester,non-reactive polyamide (PA), modified polyether, and combinations of anyof the foregoing. Other resins characterized by medium polarity may alsobe used. In certain embodiments, a resin comprises ethylcellulose.

An organic binder may be present in an amount from 0.1 wt % to 10 wt %,from 0.1 wt % to 6 wt %, from 0.2 wt % to 4 wt %, from 0.2 wt % to 2 wt%, or from 0.2 wt % to 1 wt %, where wt % is based on the total weightof the printable composition.

An organic resin can be modified to provide improved printability andprinted line definition. An organic resin may be modified with apolysiloxane to provide either a block copolymer, a graft copolymer, ora combination thereof.

For example, a polysiloxane-modified resin can includepolysiloxane-modified acrylate resins and polysiloxane-modifiedcellulose resins such as polysiloxane-modified ethylcellulose,polysiloxane-modified ethyl hydroxyethylcellulose, polysiloxane-modifiednitrocellulose, polysiloxane-modified blends of ethylcellulose andpolysiloxane-modified phenol resins, polysiloxane-modified alkyd resins,polysiloxane-modified phenol resins, polysiloxane-modified acrylateesters, polysiloxane-modified xylenes, polysiloxane-modifiedpolybutanes, polysiloxane-modified polyesters, polysiloxane-modifiedureas, polysiloxane-modified melamines, polysiloxane-modified vinylacetate resins, polysiloxane-modified wood rosin, polysiloxane-modifiedpolymethacrylates of alcohols, and combinations of any of the foregoing.

Other suitable polysiloxane-modified resins include, for example,polysiloxane-modified ethyl cellulose, polysiloxane-modified celluloseester (CAB, CAP), polysiloxane-modified polyacrylate,polysiloxane-modified polyvinyl butyral (PVB), polysiloxane-modifiedpolyvinyl pyrrolidone (PVP), saturated polyester, polysiloxane-modifiedpolyamide (PA), polysiloxane-modified polyethers, and combinations ofany of the foregoing. In certain embodiments, a polysiloxane-modifiedresin comprises polysiloxane-modified ethyl cellulose.

A polysiloxane-modified resin can comprise a silicone-modified alkydresin, a polysiloxane-modified polyester resin, a polysiloxane-modifiedacrylic resin, or a combination of any of the foregoing.

Siloxanes can also include silane-modified resins. As withsiloxane-modified resins, a silane-modified resin can include asilane-modified copolymer, a silane-modified grafted polymer, or acombination thereof. A silane comprises an alkoxysilyl group and areactive group. The alkoxysilyl group can have the structure —Si(OR)₃,where each R is independently selected from C₁₋₆ alkyl, such as methyl,ethyl, and n-propyl. The reactive group can be, for example, an aminogroup, and epoxy, a thiol, an isocyanate, an alkenyl, hydroxyl, or anacid anhydride. The reactive group can be selected to co-react with areactive functional group of the polymer resin. The reactive group ofthe polymer resin may be a terminal group, a pendent group, or both aterminal group and a pendent group. In the silane, the alkoxysilyl groupand the reactive group can be separated by a linking group. In certainembodiments, a silane comprises two or more reactive groups.

A silane having two or more reactive groups can be reacted with apolymer resin to form a silane-containing polymer resin. A silane havingone reactive group can be reacted with a polymer resin to provide apolymer resin having terminal or pendent moieties terminated withalkoxysilyl groups.

Silanes can be low molecular weight compounds such as characterized by amolecular weight, for example, less than 2,000 Daltons, less than 1,500Daltons, less than 1,000 Daltons, or less than 500 Daltons.

Reactive silanes and reactive siloxanes are available, for example, fromGelest, Inc., Shin-Etsu Chemical Co., Ltd, and from NuSil.

A siloxane can be the main solid of the organic binder in ametallization paste.

Siloxanes can show shear-thinning behavior when used in lowconcentration and can yield appropriate thixotropic properties with asuitable storage modulus behavior at high shear rate.

A siloxane can include hydrophobic terminal groups such as alkyl groupssuch as methyl, ethyl and propyl groups, cycloalkyl groups, and arenegroups such as phenyl groups.

A siloxane can comprise a poly(methylhydrosiloxane) characterized by amolecular weight from 1,000 Daltons to 6,000 Daltons, from 1,200Daltons, to 5,000 Daltons, from 1,200 Daltons to 4,000 Daltons.

A metallization paste can comprise less than 1.5 wt % of a siloxane,less than 1 wt % of a siloxane, less than 0.5 wt % of a siloxane, lessthan 0.4 wt %, less than 0.3 wt %, less than 0.2 wt % or less than 0.1wt % of a siloxane, where wt % is based on the total weight of themetallization paste.

A metallization paste can comprise, for example, from 0.1 wt % to 1 wt %of a siloxane, from 0.1 wt % to 0.8 wt %, for 0.2 wt % to 0.7 wt %, orfrom 0.3 wt % to 0.6 wt % of a siloxane, where wt % is based on thetotal weight of the metallization paste.

A metallization paste can comprise, for example, from 0.01 wt % to 0.4wt % of a polysiloxane-modified resin and from 0.01 wt % to 6 wt % of apolysiloxane, from 0.01 wt % to 0.3 wt % of a polysiloxane-modifiedresin and from 0.1 wt % to 5 wt % of a polysiloxane, or from 0.01 wt %to 0.2 wt % of a polysiloxane-modified resin and from 0.1 wt % to 4 wt %of a polysiloxane.

A siloxane can have a fine powder size of no more than a few micron andcan swell in an appropriate solvent, such as glycol ether and/or glycolether acetate, used in the organic vehicle.

A siloxane can be a liquid, a solid, or a combination thereof. Asiloxane can be supplied in the form of a fluid, an emulsion, anelastomer, and/or a resin. A siloxane elastomer can comprise a siloxanehaving, for example, hydroxyl, alkenyl, epoxy, isocyanate, amine, orother reactive functional groups or side chains. The reactive functionalgroups or side chains can be selected to be reactive with for example,esters or other components of the metallization paste.

As a solid, a siloxane can be in the form of particles, where theparticles can have dimensions, for example, less than 20 μm, less than15 μm, less than 10 μm, less than 5 μm, less than 1 μm, less than 0.5μm, or less than 0.1 μm. Particles can have an average dimension, forexample, from 0.1 μm to 20 μm, from 0.1 μm to 15 μm, from 0.1 μm to 10μm, or from 1 μm to 10 μm.

In certain embodiments, a siloxane particle can swell in the presence ofa solvent used in the metallization paste. For example, a siloxaneparticle can swell in the presence of glycol ether and/or glycol etheracetate, or other metallization paste solvent. In certain embodiments, asiloxane particle does not swell in the presence of a solvent or othercomponent used in the metallization paste.

Siloxanes can be selected to impart shear-thinning behavior in lowconcentration to a metallization paste and yield suitable thixotropicproperties and storage modulus at high shear rate.

The use of siloxanes such as polysiloxane-modified resins can alsoimprove the hydrophobicity of a metallization paste.

A solar cell metallization paste can contain from 55 wt % to 95 wt % Agparticles, less than 5 wt % glass frit, and less than 10 wt % of vehiclebinder, where wt % is based on the total weight of the metallizationpaste.

A metallization paste can contain from 80 wt % to 95 wt % Ag particles,from 2 wt % to 4 wt % glass frit, and from 6 wt % to 10 wt % of anorganic vehicle, where wt % is based on the total weight of themetallization paste.

A metallization paste can contain from 85 wt % to 95 wt % Ag particles,from 2.5 wt % to 3.5 wt % glass frit, and from 7 wt % to 9 wt % of anorganic vehicle, where wt % is based on the total weight of themetallization paste.

Metallization paste compositions provided by the present disclosure caninclude silver particles as the primary electrically conductivematerial. The silver particles can have an average particle diameterD50, for example, from 1 μm to 200 μm, from 1 μm to 150 μm, from 1 μm to100 μm, from 1 μm to 50 μm, from 1 μm to 30 μm, or from 1 μm to 20 μm.The silver particles can comprise a combination of silver particles withthe different silver particles characterized by a different meanparticle diameter. The silver particles can be characterized by adistribution of particle diameters.

The silver particles can have an average particle diameter (D50), forexample, from 0.1 μm to about 10 μm, or from 0.5 μm to 5 μm. The averageparticle diameter may be measured using, for example, using a HoribaLA-960 particle size analyzer after dispersing the conductive silverparticles in isopropyl alcohol (IPA) at 25° C. for 3 minutes byultrasonication. Within this range of average particle diameter, thecomposition can provide low contact resistance and low line resistance.

The silver particles may have, for example, a spherical, flake oramorphous shape, or a combination of any of the foregoing.

A metallization paste can comprise, for example, from 60 wt % to 95 wt%, from 70 wt % to 95 wt %, from 80 wt % to 95 wt %, or from 85 wt % to95 wt % of silver particles, where wt % is based on the total weight ofthe metallization paste.

A metallization paste can include inorganic particles such as fumedsilica.

Fumed silica can be used to control the degree of etching of theanti-reflection layer by the glass frit, and can minimize diffusion ofthe glass frit into the silicon wafer during the firing process, whichwould otherwise introduce undesirable impurities into the siliconsubstrate.

The fumed silica can be a synthetic silica prepared by a drying method,and may have a high purity of about 99.9% or more. The fumed silica maybe prepared, for example, by thermal decomposition of a chlorosilanecompound in a gas phase.

The fumed silica can have a specific surface area, for example, from 20m²/g to 500 m²/g, such as from 50 m²/g tot 200 m²/g. Within this range,it is possible to adjust the degree of etching and secure the flow forminimizing diffusion of impurities into the wafer during the firingprocess, thereby reducing series resistance due to the diffusion ofimpurities while improving fill factor and conversion efficiency. Incertain embodiments, the fumed silica may have a specific surface areaof about 20 m²/g, 30 m²/g, 40 m²/g, 50 m²/g, 60 m²/g, 70 m²/g, 80 m²/g,90 m²/g, 100 m²/g, 110 m²/g, 120 m²/g, 130 m²/g, 140 m²/g, 150 m²/g, 160m²/g, 170 m²/g, 180 m²/g, 190 m²/g, or 200 m²/g.

The fumed silica may be present in an amount, for example, of about 0.2wt % or less, such as from 0.01 wt % to about 0.15 wt %, where wt % isbased on the total weight of the composition. When the amount of fumedsilica exceeds about 0.1 wt %, the viscosity of the composition can betoo high for screen printing. The fumed silica may be present, forexample, in an amount of 0.01 wt %, 0.02 wt %, 0.03 wt %, 0.04 wt %,0.05 wt %, 0.06 wt %, 0.07 wt %, 0.08 wt %, 0.09 wt %, 0.1 wt %, wherewt % is based on the total weight of the metallization paste. Ametallization paste can comprise, for example, from 0.01 wt % to 0.15 wt%, from 0.03 wt % to 0.14 wt %, from 0.05 wt % to 0.13 wt %, from 0.07wt % to 0.12 wt %, or from 0.09 wt % to 0.11 wt % fumed silica, where wt% is based on the total weight of the metallization paste.

Glass frit serves to enhance adhesion between the conductive silverparticles and the silicon substrate and to form silver crystal grains inan emitter region by etching a passivation layer or antireflectioncoating (ARC) overlying the silicon substrate and aiding the partialdissolution or partial melting the silver particles so as to reducecontact resistance.

Glass frit can comprise a rare earth metal such as lanthanum, yttrium,or a combination thereof. Other suitable rare earth metals includescandium (Sc), cerium (Ce), praseodymium (Pr), neodymium Nd), promethium(Pm), samarium (Sm), europium (Eu), gadolinium (Gd), terbium (Tb),dysprosium (Dy), holmium (Ho), erbium Er), thulium (Tm), and lutetium(Lu).

Glass frit can comprise lead (Pb), bismuth (Bi), germanium (Ge), gallium(Ga), boron (B), iron (Fe), silicon (Si), zinc (Zn), tantalum (Ta),antimony (Sb), lanthanum (La), selenium (Se), phosphorus (P), chromium(Cr), lithium (Li), tungsten (W), magnesium (Mg), cesium (Cs), strontium(Sr), molybdenum (Mo), titanium (Ti), tin (Sn), indium (In), vanadium(V), barium (Ba), nickel (Ni), copper (Cu), sodium (Na), potassium (K),arsenic (As), cobalt (Co), zirconium (Zr), manganese (Mn), aluminum(Al), or a combination of any of the foregoing. For example, a glassfrit can comprise lead Pb, tellurium Te, bismuth Bi, tungsten W, copperCu, and a rare earth selected from lanthanum La, yttrium Y, or acombination thereof.

Glass frit can comprise lanthanum, lead, tellurium, bismuth, tungsten,and copper. For example, glass frit can comprise from 0.01 wt % to 1 wt% lanthanum, from 16 wt % to 36 wt % lead, from 34 wt % to 53 wt %tellurium, from 10 wt % to 25 wt % bismuth, from 0.09 wt % to 4.5 wt %tungsten, and from 0.1 wt % to 2 wt % copper, where wt % is based on thetotal weight of the glass frit. For example, glass frit can comprisefrom 0.01 wt % to 1 wt % lanthanum, from 24 wt % to 38 wt % lead, from42 wt % to 45 wt % tellurium, from 16 wt % to 19 wt % bismuth, from 2 wt% to 4 wt % tungsten, and from 1 wt % to 3 wt % copper, where wt % isbased on the total weight of the glass frit.

Glass frit can comprise yttrium, lead, tellurium, bismuth, tungsten, andcopper. For example, glass frit can comprise from 0.01 wt % to 1 wt %yttrium, from 16 wt % to 36 wt % lead, from 34 wt % to 53 wt %tellurium, from 10 wt % to 25 wt % bismuth, from 0.09 wt % to 4.5 wt %tungsten, and from 0.1 wt % to 2 wt % copper, where wt % is based on thetotal weight of the glass frit. For example, glass frit can comprisefrom 0.01 wt % to 1 wt % yttrium, from 24 wt % to 38 wt % lead, from 42wt % to 45 wt % tellurium, from 16 wt % to 19 wt % bismuth, from 2 wt %to 4 wt % tungsten, and from 1 wt % to 3 wt % copper, where wt % isbased on the total weight of the glass frit.

Glass frit comprises lanthanum, yttrium, lead, tellurium, bismuth,tungsten, and copper. For example, a glass frit can comprise from 0.01wt % to 1 wt % of a combination of lanthanum and yttrium, from 16 wt %to 36 wt % lead, from 34 wt % to 53 wt % tellurium, from 10 wt % to 25wt % bismuth, from 0.09 wt % to 4.5 wt % tungsten, and from 0.1 wt % to2 wt % copper, where wt % is based on the total weight of the glassfrit. For example, glass frit can comprise from 0.01 wt % to 1 wt % of acombination of lanthanum and yttrium, from 24 wt % to 38 wt % lead, from42 wt % to 45 wt % tellurium, from 16 wt % to 19 wt % bismuth, from 2 wt% to 4 wt % tungsten, and from 1 wt % to 3 wt % copper, where wt % isbased on the total weight of the glass frit.

Glass frit may be formed from the corresponding oxides.

Glass frit can be formed from a composition comprising lanthanum oxide(La₂O₃), lead oxide (PbO), tellurium oxide (TeO), bismuth oxide (Bi₂O₃),tungsten oxide (WO₃), and copper oxide (Cu₂O). For example, glass fritcan be prepared from a composition comprising from 0.01 wt % to 1 wt %lanthanum oxide, from 20 wt % to 60 wt % lead oxide, from 20 wt % to 60wt % tellurium oxide, from 1 wt % to 30 wt % bismuth oxide, from 0.1 wt% to 5 wt % tungsten oxide, and from 0.1 wt % to 5 wt % copper oxide,where wt % is based on the total weight of the glass frit. For example,glass frit can be prepared from a composition comprising from 0.01 wt %to 1 wt % lanthanum oxide, from 21 wt % to 35 wt % lead oxide, from 40wt % to 55 wt % tellurium oxide, from 15 wt % to 25 wt % bismuth oxide,from 2 wt % to 4 wt % tungsten oxide, and from 1 wt % to 2 wt % copperoxide, where wt % is based on the total weight of the glass frit.

Glass frit can be characterized, for example, by a molar ratio ofbismuth Bi to tellurium Te from 0.01 to 0.5, from 0.05 to 0.4, from 0.1to 0.3, or from 0.2 to 0.3. Glass frit can be characterized, forexample, by an average particle diameter D50 within a range from 0.1 μmto about 20 μm, and may be present in the metallization paste in anamount of about 0.5 wt % to about 20 wt %, where wt % is based on thetotal weight of the metallization paste. The average particle diametercan be determined using a particle size analyzer. The glass frit mayhave, for example, a spherical or amorphous shape. A metallization pastecomposition can contain, for example, from 0.5 wt % to 5 wt % glassfrit, from 1 wt % to 4 wt %, from 1.5 wt % to 4 wt %, or from 1.5 wt %to 3.5 wt %, where wt % is based on the total weight of the composition.

Glass frit can be characterized by a glass transition temperature(T_(g)) within a range from 200° C. to 800° C., such as, for example,within a range from 200° C. to 600° C., or within a range from 300° C.to 600° C.

Glass frit can comprise a combination of one or more types of glass frithaving different average particle diameters and/or glass transitiontemperatures. For example, glass frit can comprise a combination of afirst glass frit characterized by a glass transition temperature withina range from 200° C. to 320° C. and a second glass frit characterized bya glass transition temperature within a range from 300° C. to 550° C.,where the weight ratio of the first glass frit to the second glass fritcan range, for example, from about 1:0.2 to 1:1.

A metallization paste may also include an organic vehicle, where theorganic vehicle can include, for example, an organic binder, an organicsolvent, an additive, or a combination of any of the foregoing.

A metallization paste provided by the present disclosure can comprise,for example, from 0.01 wt % to 5 wt % of an organic binder; from 1 wt %to 45 wt % of a solvent; and from 0.01 wt % to 5 wt % of one or moreadditives, where wt % is based on the total weight of the composition.

An organic binder, also referred to as an organic resin, can be used toimpart a desired viscosity and/or rheological property to ametallization paste to facilitate screen printing solar cell electrodes.The organic binder can also facilitate homogeneous dispersion of theinorganic component within the printable composition. A composition cancomprise an organic binder or combination of organic binders.

Suitable organic binders include, for example, acrylate resins andcellulose resins such as ethylcellulose, ethyl hydroxyethylcellulose,nitrocellulose, blends of ethylcellulose and phenol resins, alkydresins, phenol resins, acrylate esters, xylenes, polybutanes,polyesters, ureas, melamines, vinyl acetate resins, wood rosin,polymethacrylates of alcohols, and combinations of any of the foregoing.

Other suitable resins include, for example, ethyl cellulose, celluloseester (CAB, CAP), polyacrylate, silicone (modified), polyvinyl butyral(PVB), polyvinyl pyrrolidone (PVP), saturated polyester, non-reactivepolyamide (PA), modified polyether, and combinations of any of theforegoing. Other resins characterized by medium polarity may also beused. In certain embodiments, a resin comprises ethyl cellulose. Ametallization paste provided by the present disclosure can compriseethylcellulose as an organic binder.

The organic binder may be present in an amount from 0.1 wt % to 10 wt %,from 0.1 wt % to 6 wt %, from 0.1 wt % to 4 wt %, from 0.1 wt % to 2 wt%, or from 0.1 wt % to 1 wt %, where wt % is based on the total weightof the printable metallization paste.

An organic binder can comprise a siloxane or combination of siloxanes.An organic binder can comprise a siloxane and one or more other organicresins. An organic binder can consist essentially of a siloxane orcombination of siloxanes, such as poly(dimethylsiloxane), apoly(dimethylsiloxane)-modified resin, poly(methylhydrosiloxane), apoly(methylhydrosiloxane)-modified resin, or a combination of any of theforegoing.

A metallization paste provided by the present disclosure can contain abinder such as ethylcellulose and a siloxane such aspoly(dimethylsiloxane), a poly(dimethylsiloxane)-modified resin,poly(methylhydrosiloxane), a poly(methylhydrosiloxane)-modified resin,or a combination of any of the foregoing. The wt % ratio such as ethylcellulose to a polysiloxane can be in the range of 0 to 0.5.

A metallization paste can comprise an organic solvent or combination oforganic solvents.

An organic solvent can be used to impart solubility, dispersion, and/orcoupling to the metallization paste. Some of the solvent in ametallization paste can be replaced with a siloxane provided by thepresent disclosure.

Examples of suitable solvents include terpineol, glycol ether, glycolether acetate, Texanol™ (ester alcohol), tributyl citrate, tributylO-acetylcitrate, DBE® esters (mixture of dimethyl adipate, dimethylglutarate and dimethyl succinate); dimethyl phthalate (DMP), andcombinations of any of the foregoing. A suitable solvent can have, forexample, a boiling point greater than 200° C. and an evaporation rateless than 0.01 at room temperature. A suitable solvent can be anoxygenated solvent including alcohols such as ethanol, methanol,butanol, n-propyl alcohol, isobutyl alcohol, and isopropyl alcohols;esters such as ethyl acetate, n-butyl acetate, n-propyl acetate, andisopropyl acetate; and ketones such as acetone, diacetone alcohol,isophorone, cyclohexanone, methyl ethyl ketone, and methyl isobutylketone. Other suitable ethers, alcohols, and/or esters may also be used.

In certain embodiments, a solvent can comprise a glycol ether, glycolether acetate, or a combination thereof.

Other examples of suitable solvents include hexane, toluene, ethylcellusolve, cyclohexanone, butyl cellusolve, butyl carbitol (diethyleneglycol monobutyl ether), dibutyl carbitol (diethylene glycol dibutylether), butyl carbitol acetate (diethylene glycol monobutyl etheracetate), propylene glycol monomethyl ether, hexylene glycol, terpineol,methylethylketone, benzyl alcohol, γ-butyrolactone, ethyl lactate, andcombinations of any of the foregoing.

A metallization paste can include from 1 wt % to 15 wt %, from 2 wt % to10 wt %, from 3 wt % to 9 wt %, or from 5 wt % to 8 wt % of an organicsolvent, where wt % is based on the total weight of the printable,metallization paste.

A metallization paste may further include additives to modify thephysical properties of the paste such as to enhance flow, processproperties, and stability. Additives may include, for example,dispersants, thixotropic agents, plasticizers, viscosity stabilizers,anti-foaming agents, surfactants, pigments, UV stabilizers,antioxidants, coupling agents, and combinations of any of the foregoing.

An additive or combination of additives may be present in thecomposition in an amount, for example, from 0.1 wt % to about 5 wt %,from 0.1 wt % to 1.5 wt %, from 0.5 wt % to 1.5 wt % or from, 0.3 wt %to 1 wt %, where wt % is based on the total weight of the printablemetallization paste. The additive can comprise a thixotropic additive, adispersant, or a combination thereof.

A metallization paste can be characterized by a viscosity, for example,of less than 450 Pa-sec or less than 430 Pa-sec.

A metallization paste can exhibit a viscosity, for example, from 100Pa-sec to 450 Pa-sec, such as from 100 Pa-sec to 360 Pa-sec determinedusing a Brookfield DV-III+viscometer with a SC4-14 spindle at 10 rpm anda temperature of 25° C.

A metallization paste can exhibit a viscosity, for example, from 10Pa-sec to 2,000 Pa-sec, from 25 Pa-sec to 1,500 Pa-sec, from 50 Pa-secto 1,000 Pa-sec, from 75 Pa-sec to 750 Pa-sec, or from 100 Pa-sec to 500Pa-sec, determined using a Brookfield DV-III+viscometer with a SC4-14spindle at 10 rpm and a temperature of 25° C. A metallization paste canexhibit a viscosity, for example, from 100 Pa-sec to 500 Pa-sec, from125 Pa-sec to 400 Pa-sec, from 150 Pa-sec to 350 Pa-sec, or from 200Pa-sec to 300 Pa-sec determined using a Brookfield DV-III+viscometerwith a SC4-14 spindle at 10 rpm and a temperature of 25° C. Ametallization paste with an organic vehicle characterized by a surfacetension from 5 dyn/cm to 35 dyn/cm, from 10 dyn/cm to 30 dyn/cm from 15dyn/cm to 30 dyn/cm or from 18 dyn/cm to 25 dyn/cm, determined using thecapillary method.

A printable metallization paste can include, for example, from 0.1 wt %to 1 wt % of a siloxane, from 80 wt % to 95 wt % Ag particles, from 1 wt% to 5 wt % of glass frit, from 0.025 wt % to 0.2 wt % fumed silica,from 0.2 wt % to 0.6 wt % organic binder, from 5 wt % to 9 wt % solvent,from 0.2 wt % to 1 wt % thixotropic additive, and from 0.05 wt % to 0.35wt % dispersant, where wt % is based on the total weight of theprintable metallization paste.

A printable metallization paste can include, for example, from 0.2 wt %to 0.6 wt % of a siloxane, from 85 wt % to 92 wt % Ag particles, from1.5 wt % to 4 wt % of glass frit, from 0.05 wt % to 0.15 wt % fumedsilica, from 0.3 wt % to 0.5 wt % organic binder, from 5.5 wt % to 8 wt% solvent, from 0.3 wt % to 0.7 wt % thixotropic additives, and from 0.1wt % to 0.3 wt % dispersant, where wt % is based on the total weight ofthe printable metallization paste.

A printable metallization paste can comprise, for example, from 83 wt %to 95 wt % silver particles, form 1 wt % to 5 wt % glass frit, from 0.01wt % to 1 wt % silica, from 0.1 wt % to 1 wt % binder, from 2 wt % to 10wt % solvent, from 0.1 wt % to 2 wt % additives, and from 0.1 wt % to 1wt % siloxanes.

A printable metallization paste can comprise, for example, from 85 wt %to 93 wt % silver particles, form 2 wt % to 4 wt % glass frit, from 0.05wt % to 0.5 wt % silica, from 0.2 wt % to 0.5 wt % binder, from 4 wt %to 8 wt % solvent, from 0.5 wt % to 1.5 wt % additives, and from 0.2 wt% to 0.7 wt % siloxanes.

For screen printing fine lines with a high aspect ratio it is desirablethat a metallization paste provided by the present disclosure exhibit aviscosity within the range from 50 Pa-sec to 700 Pa-sec at a temperaturefrom 15° C. to 50° C., as determined using a BrookfieldDV-III+viscometer with a SC4-14 spindle at 10 rpm and a temperature of25° C. For example, an electrode can be characterized by an aspect ratiogreater than 0.3, greater than 0.4, greater than 0.5, greater than 0.6,greater than 0.7, greater than 0.8, greater than 0.9, or greater than 1,where aspect ratio refers to the line height divided by the line width.An electrode can have an aspect ratio, for example, from 0.3 to 1, from0.4 to 0.8, from 0.4 to 0.6, from 0.5 to 1, or from 0.5 to 0.8.

It can also be desirable that a metallization paste exhibit a glasstransition temperature T_(g) from 200° C. to 800° C. as determined usingdifferential scanning calorimetry (DSC).

The metallization paste can be prepared using the following procedure.

The glass frit can be prepared by combining the metal oxides, meltingthe combined metal oxides to form a glass, quenching the glass, andmilling the glass to provide glass frit with a desired mean particlediameter and dispersity.

The organic vehicle can be prepared by mixing and heating a solvent ormixture of solvents and organic binder or organic binders, and additivessuch as rheological thixotropic additive, plasticizer, and/or defoamingagents; and siloxanes.

Silver Ag particles can be combined with the organic vehicle, and glassfrit, inorganic particles and other components such as siloxanes andthoroughly mixed.

The metallization paste can then be milled to achieve a desireddispersion of the inorganic components. The metallization paste can thenbe filtered to remove any undesired large particulates.

The metallization paste can be applied to a front surface of a siliconsolar cell by screen printing. The screen used in solar cell screenprinting can be a mesh covered by an emulsion which is patterned to formthe grid pattern. The mesh number can be, for example, from 300 mesh to800 mesh, from 300 mesh to 400 mesh, such as from 325 mesh to 380 meshand the mesh wire, which can be stainless steel, can have a diameterfrom about 0.3 mils to 1.5 mils, such as a diameter from 0.4 mils to 1.1mils. Other screens and mesh sizes can be used as appropriate for aparticular metallization paste, process conditions, and desired featuresizes.

The deposited metallization paste in the form of electrical conductorssuch as grid lines can have, for example, a width from 0.5 mils to 4mils, and a height from 0.1 mils to 1.5 mils.

After being applied to a Si substrate, the screen-printed compositioncan be dried, for example, at a temperature from 200° C. to 400° C. forfrom 10 seconds to 60 seconds, and then baked and fired at a temperaturefrom 400° C. to 950° C., or from 30 seconds to 50 seconds, with a peakfiring temperature in the range of 750° C. to 950° C., to providefrontside electrical conductors.

Electrical conductors having dimensions of 1.2 mm width and 16 μm heightcan exhibit electrical resistivity of 1.8 μΩ-cm and can exhibit anadhesion strength of at least 2 N on a silicon substrate, where theelectrical conductivity is determined according to line resistivityelectrical probe measurement and the adhesion strength is determinedaccording to a 180° solder tab pull test. For context, Ag thick-filmbusbars having a resistivity less than 2 μΩ-cm and an adhesion strengthgreater than 1.5 N are generally considered acceptable for use in thesolar cell industry.

Solar cell conductive electrodes prepared from compositions provided bythe present disclosure maintain acceptable conductivity and adhesionstrength following exposure to accelerated environmental test conditionsincluding damp-heat testing and accelerated thermal cycling, which areused to qualify solar cells for a 25-year service life.

FIG. 1 is a graph showing the viscosity of metallization pastes withshear rate. FIG. 1 shows a hysteresis curve of the viscosity ofmetallization pastes with increasing and then decreasing shear rate. Formetallization paste A the organic binder was ethylcellulose and did notcontain a siloxane. For metallization paste B some of the solvent wasreplaced with a polysiloxane, As shown by the shear-thinning flowcurves, a siloxane, in this case poly(methylhydrosiloxane), reduced theinitial viscosity (zero shear) and maintained the shear-thinning andthixotropic behavior at increasing shear rates. At high shear rates thesiloxane-containing metallization paste exhibited the same low viscosityas the metallization paste without a siloxane. The shear rate (1/sec)dependent viscosity in FIG. 1 was determined using a BrookfieldDV-III+rheometer R/S-CP+with spindle RC3-25-1 at a temperature of 25° C.

In Paste C a polysiloxane-modified resin was used in the metallizationpaste which significantly improved the thixotropic behavior comparedwith Pastes A and B. The initial viscosity was similar to that of pasteB, as shown in the rheology graph of FIG. 1. Paste C had the highestprint wet-weight (see Table 4) for the same print speed as the otherpastes, which resulted in superior electrical performance for the solarcell employing Paste C. Solar cells having gridlines prepared with PasteC exhibited the highest short-circuit current of 9.3 A. Paste C is thehighest wet weight (0.128 g) compared to the other metallization pastesevaluated. Also, gridlines prepared using Paste C exhibit the narrowestmedian line width of about 41 μm, gridlines are less wavy compared togridlines prepared using the other metallization pastes as reflected bythe maximum and minimum widths, and have the highest aspect ratio due toincreased height. Due to at least these factors, solar cells havinggridlines prepared using Paste C exhibit the highest photocurrent.

FIGS. 2A and 2B show electroluminescence (EL) images of gridlines on amicrocrystalline silicon solar cell printed using a metallization pastewithout a polysiloxane-modified resin and with a polysiloxane-modifiedresin, respectively.

FIG. 2A and FIG. 2B demonstrate the effects of including a polysiloxanein a metallization paste on solar cell gridline integrity. FIG. 2B showsan electroluminescence image of a polycrystalline silicon solar cell inwhich gridlines having a width of about 41 μm were printed using ametallization paste comprising both a polysiloxane(poly(methylhydrosiloxane)) and a polysiloxane-modified resin(polydimethylsiloxane-modified resin). The composition metallizationpaste is described in Example 3 and the process for fabricating thegridlines is described in Example 1. FIG. 2A shows anelectroluminescence image of a polycrystalline silicon solar cell withgridlines fabricated as in FIG. 2B, except that the metallization pastedid not contain a polysiloxane-modified resin. As can be appreciated bycomparing the electroluminescence images shown in FIG. 2A and FIG. 2B,the number of gridline discontinuities is reduced using a metallizationpaste containing a polysiloxane-modified resin compared to the solarcell having grid lines prepared using a metallization paste without apolysiloxane-modified resin.

Silicon solar cells having electrodes made from the metallization pastesprovided by the present disclosure can be incorporated into photovoltaicmodules and photovoltaic systems.

According to an aspect of the invention, a metallization paste comprisesfrom 0.01 wt % to 3 wt % of a siloxane, wherein the siloxane comprises apolysiloxane, a polysiloxane-modified resin, or a combination thereof;and wt % is based on the total weight of the metallization paste.

According to any of the preceding aspects, the siloxane comprises apolysiloxane-modified resin.

According to any of the preceding aspects, the siloxane comprises apoly(methylhydrosiloxane), a poly(methylhydrosiloxane)-modified resin ora combination of any of the foregoing.

According to any of the preceding aspects, the siloxane comprises apoly(methylhydrosiloxane) and a polydimethylsiloxane-modified resin.

According to any of the preceding aspects, the siloxane is characterizedby a molecular weight from 1,500 Daltons to 4,000 Daltons, and aviscosity from 10 cSt to 60 cSt.

According to any of the preceding aspects, the siloxane is characterizedby a molecular weight from 500 Daltons to 20,000 Daltons.

According to any of the preceding aspects, the metallization pastecomprises glycol ether, glycol ether acetate, or a combination thereof.

According to any of the preceding aspects, the metallization paste ischaracterized by a viscosity less than 370 Pa-sec determined using aBrookfield DV-III+viscometer with a SC4-14 spindle at 10 rpm and atemperature of 25° C.

According to any of the preceding aspects, the metallization paste ischaracterized by a viscosity within a range from 190 Pa-sec to 350Pa-sec determined using a Brookfield DV-III+viscometer with a SC4-14spindle at 10 rpm and a temperature of 25° C.

According to any of the preceding aspects, the metallization paste ischaracterized by a viscosity within a range from 190 Pa-sec to 350Pa-sec determined using a Brookfield DV-III+viscometer with a SC4-14spindle at 10 rpm and a temperature of 25° C.; and a surface tensionwithin a range from 5 dyn/cm to 35 dyn/cm.

According to any of the preceding aspects, the metallization pastefurther comprises silver particles and glass frit.

According to any of the preceding aspects, the metallization paste ischaracterized by a surface tension within a range from 15 dyn/cm to 30dyn/cm.

According to an aspect of the invention, a solar cell electrode isprepared from the metallization paste according to the presentinvention.

According to any of the preceding aspects, the electrode ischaracterized by an aspect ratio greater than 0.4.

According to an aspect of the invention, a solar cell electrode isprepared by applying the metallization paste according to the presentinvention to a surface of a solar cell; drying the applied metallizationpaste; and firing the dried metallization paste to provide a solar cellelectrode.

According to any of the preceding aspects, applying the metallizationpaste comprises screen printing the metallization paste through a wirescreen having a 300 mesh to 400 mesh, at a printing speed of at least200 mm/sec.

According to any of the preceding aspects, the electrode ischaracterized by an aspect ratio greater than 0.4.

According to an aspect of the invention, a method of fabricating a solarcell electrode, comprises applying the metallization paste according tothe present invention to a surface of a solar cell; drying the appliedmetallization paste; and firing the dried metallization paste to providea solar cell electrode.

According to any of the preceding aspects, applying the metallizationpaste comprises screen printing the metallization paste through a wirescreen having a 300 mesh to 400 mesh, at a printing speed of at least200 mm/sec.

EXAMPLES

Embodiments provided by the present disclosure are further illustratedby reference to the following examples, which describe solar cellmetallization pastes and properties of gridlines formed using themetallization pastes according to the present invention. It will beapparent to those skilled in the art that many modifications, both tomaterials, and methods, may be practiced without departing from thescope of the disclosure.

Example 1 Metallization Paste

A metallization paste without added siloxane was prepared from thecomponents listed in Table 1.

TABLE 1 Metallization Paste A. Content Material Product No. Source (wt%) Ag Particles AG-4-8 Dowa Hightech 89 Glass Frit Pb-Te-Bi glassInternal 3 Fumed Silica Aerosil ® 200 Evonik Co. 0.1 Binder ETHOCEL ™Dow Chemical 0.4 Ethylcellulose STD4 Solvent Texanol ™ ester alcoholEastman Chemical 6.8 Thixotropic Thixatrol ® ST Elementis Co. 0.5Additive Dispersant DISPERBYK ® 102 BYK-chemie 0.2

To prepare the metallization paste, an organic binder, 0.4 wt % ofETHOCEL™ ethylcellulose (STD4, Dow Chemical Company), was dissolved in6.8 wt % of Texanol™ (Texanol™ ester-alcohol, Eastman Chemical Company)at 60° C., and 89 wt % of spherical silver particles (AG-4-8, DowaHightech Co., Ltd.) having an average particle diameter of 2.0 μm, 3 wt% glass frit having an average particle diameter of 1.0 μm and atransition temperature T_(g) of 350° C., 0.1 wt % of fumed silica(Aerosil® 200, Evonik Co., Ltd.) having a BET specific surface area of200±25 m²/g, 0.2 wt % of a dispersant (DISPERBYK® 102, BYK-chemie), and0.5 wt % of a thixotropic agent (Thixatrol® ST, Elementis Co., Ltd.)were added to the binder solution, followed by mixing and kneading in a3-roll mill, to prepare a screen printable metallization paste.

The composition was deposited by screen printing in a predeterminedpattern over a front surface of a silicon wafer having ananti-reflective coating with an underlying doped Si emitter with sheetresistance of about 85 Ω/sq, followed by drying in an infrared (IR)drying furnace to remove solvent. The metallization paste was screenprinted through a stainless steel wire mesh onto a monocrystallinesilicon solar cell at a speed of 350 mm/sec to provide lines that werenominally 40 μm wide and 20 μm high.

During the drying process the printed gridlines were exposed to atemperature of about 850° C. for about 1 sec to provide sintering andohmic contact for the solar cell electrode metallization. Then, analuminum paste was printed on the back side of the silicon wafer anddried in the same manner. Solar cells formed according to this procedurewere then subjected to firing at 400° C. to 950° C. for 30 sec to 50sec, where the peak temperature is in the range of 750° C. to 950° C. ina belt-type radiation-lamp firing furnace. The fill factor (FF) and theconversion efficiency (%) of the cells were determined using a solarcell efficiency tester PSS 10 II (Berger Lichttechnik GmbH & Co.). TheFF was determined according to current-voltage curve as the ratio of themaximum-power-point to the product of the open-circuit voltage andshort-circuit current. Efficiency was determined from thecurrent-voltage curve as the percent ratio of the maximum-power-point tothe input power of the incident light on the solar cell from a solarsimulator.

The shear-rate dependent viscosity of the siloxane-containingmetallization paste A is shown in FIG. 1.

The viscosity of metallization paste A was 440 Pa-sec at a 1/se shearrate and had a Fineness of Grain (FoG) of 5 μm.

Example 2 Metallization Paste Containing a Siloxane

A siloxane-containing metallization paste was prepared from thecomponents listed in Table 2.

TABLE 2 Siloxane-containing Metallization Paste B. Content MaterialProduct No. Source (wt %) Ag Particles AG-4-8 Dowa Hightech 89 GlassFrit Pb-Te-Bi glass Internal 3 Fumed Silica Aerosil ® 200 Evonik Co. 0.1Binder ETHOCEL ™ Dow Chemical 0.4 Ethylcellulose STD4 Solvent Texanol ™ester alcohol Eastman Chemical 6.3 Thixotropic Thixatrol ® ST ElementisCo. 0.5 Additive Dispersant DISPERBYK ® 102 BYK-chemie 0.2 PolysiloxanePoly(methylhydrosiloxane) Sigma Aldrich 0.5 No. 176206

The metallization paste was prepared and applied to monocrystallinesolar cells as in Example 1.

The shear-rate dependent viscosity of the siloxane-containingmetallization paste B is shown in FIG. 1.

The viscosity of metallization paste B (Example 2) was 427 Pa-sec at a1/sec shear rate and had a FoG of 5 μm.

Example 3 Metallization Paste Containing a Siloxane and aSiloxane-Modified Resin

A siloxane-containing metallization paste was prepared from thecomponents listed in Table 5.

TABLE 5 Siloxane-containing Metallization Paste C. Content MaterialProduct No. Source (wt %) Ag Particles AG-4-8 Dowa Hightech 89 GlassFrit Pb-Te-Bi glass Internal 2.9 Fumed Silica Aerosil ® 200 Evonik Co.0.1 Binder ETHOCEL ™ Dow Chemical 0.4 Ethylcellulose STD4 SolventTexanol ™ ester alcohol Eastman Chemical 6.5 Thixotropic Thixatrol ® STElementis Co. 0.5 Additive Dispersant DISPERBYK ® 102 BYK-chemie 0.2Polysiloxane Poly(methylhydro- Sigma Aldrich 0.3 siloxane) No. 176206Polydimethyl- n/a n/a 0.1 siloxane- Modified Resin

The metallization paste containing both a polysiloxane and apolysiloxane-modified resin was applied to a monocrystalline solar cellas described in Example 2 and fired to obtain fine gridlines on thefront surface of the solar cell.

The shear-rate dependent viscosity of the siloxane-containingmetallization paste C is shown in FIG. 1.

The viscosity of metallization paste C was 370 Pa-sec at a 1/sec shearrate and had a FoG of 5 μm.

Electroluminescence (EL) images of solar cells with gridlines preparedusing the metallization paste of Example 1 and with the metallizationpaste of Example 3 are shown in FIG. 2A and FIG. 2B, respectively.

Example 4 Comparative Results

The line widths for gridlines formed using the three metallizationpastes are shown in Table 3.

TABLE 3 Gridline width. Gridline Reference Example 1 Example 2 Example 3Width Paste* Paste A Paste B Paste C Avg (μm) 41.95 46.08 40.41 41.6 Min(μm) 37.89 41.51 34.81 39.37 Max (μm) 47.79 52.08 44.45 44.45 Median(μm) 42.26 45.85 41.37 41.1 *Reference paste refers to a metallizationpaste used as a standard.

The electrical properties of gridlines fabricated using the twometallization pastes, with and without a siloxane additive, is shown inTable 4.

TABLE 4 Gridline Electronic and Print Properties. Print Wet EfficiencyWeight Paste Uoc (V) Isc (A) Rs (Ω) Rsh (Ω) FF (%) (g) Example 3 (C)0.639 9.3 0.00227 36.1 79.4 19.49 0.128 polydimethylsiloxane- modifiedresin Example 2 (B) 0.638 9.160 0.00181 118.7 80.3 19.4 0.105(polysiloxane) Example 1 (A) 0.638 9.141 0.00173 92.7 80.4 19.3 0.114Reference Paste 0.638 9.148 0.00168 59.6 80.4 19.4 0.125

In Table 4, Uoc refers to the open circuit voltage, Isc is the shortcircuit current, Rs is the sheet resistance, Rsh is the shuntresistance, FF is the fill factor, efficiency represents the efficiencyof the solar cell.

It should be noted that there are alternative ways of implementing theembodiments disclosed herein. Accordingly, the present embodiments areto be considered as illustrative and not restrictive. Furthermore, theclaims are not to be limited to the details given herein, and areentitled their full scope and equivalents thereof.

What is claimed is:
 1. A metallization paste comprising from 0.01 wt %to 3 wt % of a siloxane, wherein the siloxane comprises apolysiloxane-modified resin; wherein wt % is based on the total weightof the metallization paste.
 2. The metallization paste of claim 1,wherein the polysiloxane-modified resin comprises apolysiloxane-modified block copolymer, a polysiloxane-modified graftcopolymer, or a combination thereof.
 3. The metallization paste of claim2, wherein the polysiloxane-modified block copolymer comprises segmentsof a polysiloxane and segments of another polymer resin.
 4. Themetallization paste of claim 2, wherein the polysiloxane-modified blockcopolymer comprises polysiloxane moieties pendent from a backbone of apolymeric resin.
 5. The metallization paste of claim 1, wherein thepolysiloxane-modified resin is characterized by: a molecular weight from1,500 Daltons to 4,000 Daltons; and a viscosity from 10 cSt to 60 cSt,wherein viscosity is determined using a Brookfield DV-III+viscometerwith a SC4-14 spindle at 10 rpm at a temperature of 25° C.
 6. Themetallization paste of claim 1, wherein the polysiloxane-modified resinis characterized by a molecular weight from 500 Daltons to 20,000Daltons.
 7. The metallization paste of claim 1, wherein the siloxanefurther comprises a polysiloxane.
 8. The metallization paste of claim 7,wherein the metallization paste comprises: from 0.01 wt % to 0.4 wt % ofthe polysiloxane-modified resin; and from 0.1 wt % to 6 wt % of thepolysiloxane, wherein wt % is based on the total weight of themetallization paste.
 9. The metallization paste of claim 7, wherein, thepolysiloxane comprises a polydimethylsiloxane, apoly(methylhydrosiloxane), or a combination thereof; and thepolysiloxane-modified resin comprises a poly dimethylsiloxane-modifiedresin, a poly(methylhydrosiloxane)-modified resin, or a combinationthereof.
 10. The metallization paste of claim 7, wherein, thepolysiloxane comprises a poly(methylhydrosiloxane); and thepolysiloxane-modified resin comprises a polydimethylsiloxane-modifiedresin.
 11. The metallization paste of claim 1, wherein the metallizationpaste comprises glycol ether, glycol ether acetate, or a combinationthereof.
 12. The metallization paste of claim 1, wherein themetallization paste is characterized by a viscosity less than 370 Pa×secdetermined using a Brookfield DV-III+viscometer with a SC4-14 spindle at10 rpm and a temperature of 25° C.
 13. The metallization paste of claim1, wherein the metallization paste is characterized by a viscositywithin a range from 190 Pa×sec to 350 Pa×sec determined using aBrookfield DV-III+viscometer with a SC4-14 spindle at 10 rpm at atemperature of 25° C.
 14. The metallization paste of claim 1, whereinthe metallization paste is characterized by: a viscosity within a rangefrom 190 Pa×sec to 350 Pa×sec determined using a BrookfieldDV-III+viscometer with a SC4-14 spindle at 10 rpm at a temperature of25° C.; and a surface tension within a range from 5 dyn/cm to 35 dyn/cm,wherein the surface tension is determined using the capillary method.15. The metallization paste of claim 1, further comprising silverparticles and glass frit.
 16. The metallization paste of claim 1,wherein the metallization paste is characterized by a surface tensionwithin a range from 15 dyn/cm to 30 dyn/cm, wherein the surface tensionis determined using the capillary method.
 17. A solar cell electrodeprepared from the metallization paste of claim
 1. 18. The solar cellelectrode of claim 17, wherein the solar cell electrode is characterizedby an aspect ratio greater than 0.4.
 19. A solar cell electrode preparedby: applying the metallization paste of claim 1 to a surface of a solarcell; drying the applied metallization paste; and firing the driedmetallization paste to provide a solar cell electrode.
 20. The solarcell electrode of claim 19, wherein, applying the metallization pastecomprises screen printing the metallization paste through a wire screenhaving a 300 mesh to 400 mesh, at a printing speed of at least 200mm/sec; and the solar cell electrode is characterized by an aspect ratiogreater than 0.4.
 21. A method of fabricating a solar cell electrode,comprising: applying the metallization paste of claim 1 to a surface ofa solar cell; drying the applied metallization paste; and firing thedried metallization paste to provide a solar cell electrode.
 22. Themethod of claim 21, wherein applying the metallization paste comprisesscreen printing the metallization paste through a wire screen having a300 mesh to 800 mesh, at a printing speed of at least 200 mm/sec.